Waferpedia

Multitest

MT 8501

Test & ProbeMultitest MT 8501 family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Multitest MT 8501 is a test handler configured for DIP 300 mil packages.[1][2][3]

MultitestMT 8501
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What it is

The Multitest MT 8501 is a test handler configured for DIP 300 mil packages.[1][2][3]

How it works

General reference — not yet source-verified

A test handler typically receives devices in tubes, trays, or tape-and-reel and presents them one at a time to a test head containing a socket or contactor. After electrical testing, the handler mechanically sorts each device into one of several output bins according to test results.

The handling mechanism may use gravity feed, vibratory bowl, or pick-and-place robotics to position devices accurately at the test site. Temperature control systems can apply hot, cold, or ambient conditions during testing.

Where it fits in the process flow

General reference — not yet source-verified

In semiconductor manufacturing, final test handlers like the MT 8501 are used after wafer probing, dicing, and packaging. The handler takes assembled and packaged devices, performs final electrical test, and sorts them into grades or rejects.

What do the numbers mean?

Wafer handling2

Equipment type
Test Handler[1]
Accurate?
Handler with kit for DIP 300 mil[3]
Accurate?

Configuration & options2

Category
Test & Probe[2]
Accurate?
Package Configuration
DIP 300 mil[3]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Multitest MT 8501?

The Multitest MT 8501 is a test handler.[1][2]

What package type is the Multitest MT 8501 configured for?

The Multitest MT 8501 is configured for DIP 300 mil packages.[2][3]

Not publicly documented

The following facts about the MT 8501 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MT 8501 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the MT 8501 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the MT 8501 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MT 8501 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MT 8501 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]fabsurplus.com — fabsurplus.comfabsurplus.com
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Last updated Oct 7, 2026.

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