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A plasma etch system uses an energized gas plasma to remove material from exposed surfaces in a controlled chamber.
Etch tools remove selected films or surface regions after pattern transfer from masking steps and before later integration steps.
Plasma etch systems of this class are used for material removal on patterned substrates in semiconductor manufacturing.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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Machines of this class are used against films, surface layers, and patterned regions made from materials such as oxides, polymers, and other process layers, depending on the process chemistry.
Because the process must remove the intended material while preserving protected regions and maintaining the desired feature shape and surface condition.
The following facts about the March AP 1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the March AP 1000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the March AP 1000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the March AP 1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the March AP 1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the March AP 1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
The Lam Research 4520 Oxide Etch is a single-wafer, vacuum load-locked low-pressure plasma etch system designed for oxide etching, including contact etch and planarization, for wafers up to 200 mm.
The SPTS / STS CPX Pegasus is an etcher with 8-inch wafer support and a two-chamber configuration.
The Lam Rainbow 4420 is a plasma etcher designed for 8-inch wafer processing, supporting poly etch and CMOS processes, and running Envision software.
The Lam TCP 9600 SE Metal Etch is a plasma etch system for metal layers on 6-inch and 8-inch wafers.