Nova
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Nova NOVASCAN 3090 is a CMP metrology system. Nova NOVASCAN 3090 is a 300 mm system. Nova NOVASCAN 3090 supports high-end 65nm and 45nm CMP applications.[1]
The NovaScan 3090 is used for wafer-to-wafer process control without affecting the process tool's overall throughput.[1]
The NovaScan 3090 is used for Poly, STI, tungsten plug, and copper interconnect process steps.[1]
The NovaScan 3090 measures oxide residue, step-height for STI, profiling for tungsten plugs, residue detection, erosion, and metal line thickness for copper interconnects.[1]
The NovaScan 3090 supports thickness and shape measurement of dielectric materials and low-k materials.[1]
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The following facts about the 3090 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3090 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3090 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3090 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3090 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3090 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.