Plasma-Therm
720/740
Wafer size
200mm
Gas delivery
chlorine and fluorine based chemistry[1]
What it is
The Plasma-Therm 720/740 is a dual chamber reactive ion etching (RIE) system with a loadlock. The system accommodates wafers up to 200 mm in diameter. The left chamber, designated the 740, is configured as an Au exposure system. The right chamber, designated the 720, is configured for chlorine- and fluorine-based etching of 2D materials and perovskites.[3]
Where it fits in the process flow
General reference — not yet source-verifiedDry etching systems like the 720/740 replace wet chemical etching where precise anisotropic profiles and critical dimension control are required. The etched features may subsequently undergo resist stripping, cleaning, or deposition of additional layers.
Applications
The Plasma-Therm 720/740 is used for etching metals and dielectrics. The left chamber (740) is designated for Au exposure processes, meaning it can handle materials that are compatible with or require gold exposure. The right chamber (720) is used for chlorine- and fluorine-based etching of 2D materials such as MoS2, WSe2, NbSe2, AsSe2, and GaSe, as well as perovskites like SrRuOx, SrLaAlOx, and BaSrOx.[3]
- etching metals and dielectrics
- etching 2D materials such as MoS2, WSe2, NbSe2, AsSe2, and GaSe
- etching perovskites such as SrRuOx, SrLaAlOx, and BaSrOx
What do the numbers mean?
Wafer handling3
Gas & chemistry2
Optics & imaging1
Configuration & options1
- right chamber designation
- 720 (right chamber), designated for chlorine and fluorine based etching of 2D materials and perovskites[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 720 (right chamber) | — | — | Designated for chlorine and fluorine based etching of 2D materials and perovskites | cnf.cornell.edu[1] |
| 740 (left chamber) | — | — | Designated as Au exposure system, can etch metals and dielectrics with either Au exposure or termination | cnf.cornell.edu[1] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Oxford Instruments Plasmalab 80 Plus— Same function class: Etch, 200mmCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Plasma-Therm 720/740?
The Plasma-Therm 720/740 is a dual chamber reactive ion etching (RIE) loadlocked system.[3]
What wafer size does the Plasma-Therm 720/740 support?
The system accommodates wafers up to 200 mm in diameter.[3]
What are the designations of the two chambers?
The left chamber is designated the 740 and is configured as an Au exposure system. The right chamber is designated the 720 and is configured for chlorine- and fluorine-based etching of 2D materials and perovskites.[3]
What chemistries does the system use?
The system uses chlorine- and fluorine-based chemistries.[3]
What materials can be etched with the Plasma-Therm 720/740?
The system can etch metals, dielectrics, 2D materials such as MoS2, WSe2, NbSe2, AsSe2, and GaSe, and perovskites such as SrRuOx, SrLaAlOx, and BaSrOx.[3]
Not publicly documented
The following facts about the 720/740 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 720/740 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 720/740 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 720/740 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 720/740 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 720/740 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]cnf.cornell.edu — cnf.cornell.educnf.cornell.edu
- [2]nano.upenn.edunano.upenn.edu
- [3]720/740 — Plasma-Therm | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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