Sonoscan
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The transducer in a scanning acoustic microscope raster-scans over the sample in a C-mode (constant depth) or time-gated mode. The amplitude and time-of-flight of the reflected signals are recorded to produce two-dimensional images that reveal the presence and location of anomalies such as voids, cracks, or delaminations. The resolution and penetration depth depend on the ultrasound frequency used.
Scanning acoustic microscopes are used in semiconductor manufacturing and packaging after assembly processes to inspect bond lines, underfill layers, and die-attach interfaces. Inspection typically occurs after curing of encapsulants or underfill materials and before singulation or final test. The technique is non-destructive, so the same parts can proceed to subsequent process steps or be used for reliability testing.
In addition to underfill void detection, scanning acoustic microscopy is applied to detect delaminations in multilayer substrates, cracks in ceramic packages, voids in solders, and bond line integrity in wafer-level packaging. The technique is also used in failure analysis and process development for advanced packaging technologies.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
Normally, no special sample preparation is needed. The sample is simply immersed in or coupled to a water bath or water jet to allow ultrasonic transmission. For highly absorbent or porous materials, a thin protective layer may be used.
Solid materials with relatively low acoustic attenuation are ideal — such as plastics, ceramics, metals, and composites. Very high-loss materials like rubber or thick porous substances may limit the depth of penetration or image quality.
Scan time depends on the desired resolution, scan area, and the number of imaging modes used. A small region at coarse resolution may take a minute; large-area high-resolution scans can take considerably longer. The operator balances speed and detail for each application.
The following facts about the D 9000 Scanning Acoustic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the D 9000 Scanning Acoustic are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the D 9000 Scanning Acoustic are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the D 9000 Scanning Acoustic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the D 9000 Scanning Acoustic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the D 9000 Scanning Acoustic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Sep 30, 2026.
The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.