Strasbaugh
6 DS SP
What it is
General reference — not yet source-verifiedCMP systems are wafer finishing tools used to remove material while reducing surface topography and improving planarity. CMP sits in the fabrication flow after deposition, lithography, or pattern transfer steps when a surface must be flattened for later processing.
How it works
General reference — not yet source-verifiedCMP combines chemical action from slurry with mechanical action from a rotating polishing interface. The process uses a pad, a carrier, and controlled downforce and motion to remove elevated material across the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedCMP is commonly used when a process requires removal of uneven film thickness, topography control, or surface smoothing before further lithography or device formation. The process is part of back end and front end fabrication flows wherever planarity affects yield or overlay.
Applications
General reference — not yet source-verifiedThe class is used for polishing dielectric films, metal films, and patterned topography on semiconductor wafers. CMP is also used in device integration where a smooth, flat surface is needed for subsequent film buildup or lithography.
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
Wafer handling6
Control & software1
- Table Temperature Control Unit (SMC Chiller)[1]
Configuration & options10
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the electrical power requirement?
The tool requires 208 V, 3 phase, 60 Hz, with a full load current of 60 A, motor current of 36 A, and an interrupting capacity of 10,000 A.[1]
What types of materials can the 6 DS SP polish?
The tool is designed for oxides, tungsten, and STI applications. Additionally, it has been used in research for polishing zinc oxide (ZnO).[3][4]
Does the 6 DS SP have endpoint detection?
Yes, it features nVision Optical and Motor Current Endpoint Detection.[3]
What is the mean time between failures (MTBF) of the 6 DS SP?
The MTBF is 150 to 200 hours.[3]
Not publicly documented
The following facts about the 6 DS SP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6 DS SP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6 DS SP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6 DS SP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6 DS SP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6 DS SP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]nTEGRITY 200MM PRODUCTION CMP equipment, chemical mechanical planarizer — strasbaugh.com (Jan 6, 2009)web.archive.org
- [4]https://aaltodoc.aalto.fi/bitstreams/3e21649d-e50b-4353-a5da-943112aee797/download — aaltodoc.aalto.fiaaltodoc.aalto.fi
Last updated Oct 2, 2026.
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