Takatori
MWS 610 SD Wire Cut
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Takatori MWS 610 SD is a wire cutter. The Takatori MWS 610 SD was manufactured in 2017.[1][2][3][4][5]
What it is
How it works
General reference — not yet source-verifiedThe working principle of a wire cutter involves a long wire that is wound around multiple guide rollers to form a parallel wire web. The wire is moved in a reciprocating or unidirectional manner while being pressed against the workpiece. An abrasive slurry is applied to the wire to enhance cutting, or the wire itself is coated with fixed diamond abrasive.
Where it fits in the process flow
General reference — not yet source-verifiedIn the semiconductor manufacturing flow, wire cutting is performed after crystal growth and before wafer polishing. The wire cutter slices a cylindrical ingot into thin discs called wafers. The resulting wafers then proceed to lapping, etching, and polishing steps.
Applications
General reference — not yet source-verifiedWire cutters are primarily used for slicing silicon ingots, but they can also cut other brittle materials such as gallium arsenide, sapphire, and silicon carbide. The process is also applied in dicing operations where a wire separates substrates or packaged devices.
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What materials can a wire-cut dicing machine process?General reference — not yet source-verified
Wire-cut dicing machines of this class are designed for hard, brittle materials such as silicon, gallium arsenide, silicon carbide, sapphire, glass, and ceramics.
How does wire-cut dicing compare to blade dicing?General reference — not yet source-verified
Wire-cut dicing generally offers narrower kerf, lower mechanical stress on the die, and higher throughput for multi-cut operations because multiple parallel cuts are made in one pass. Blade dicing may be preferred for certain wafer thicknesses or when higher positional accuracy is required.
Can a wire-cut dicing machine handle very thin or thick wafers?General reference — not yet source-verified
Yes, machines of this class can be configured to handle a range of substrate thicknesses, from very thin wafers to thick substrates, by adjusting wire parameters and process conditions.
Is the wire consumable in wire-cut dicing?General reference — not yet source-verified
Yes, the wire is a consumable; it wears during cutting and is typically replaced periodically. Wire management systems control tension and feed to maintain consistent performance.
Not publicly documented
The following facts about the MWS 610 SD Wire Cut are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the MWS 610 SD Wire Cut are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS 610 SD Wire Cut are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MWS 610 SD Wire Cut are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MWS 610 SD Wire Cut are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MWS 610 SD Wire Cut are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
Last updated Sep 28, 2026.
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