Tegal
6510
The Tegal 6510 HRe is a high-density CCP plasma etch tool. The Tegal 6510 supports wafer sizes from 100mm to 200mm. The Tegal 6510 is optimized for device design rules down to 90nm.[1]
What is it?
Applications
Typical semiconductor applications for the 6510 include polysilicon/silicide gate etch, shallow trench isolation (STI) etch, selective anisotropic nitride etch for LOCOS and spacer formation, and anisotropic nitride and oxide hard mask open etch. The tool is highlighted for its use in STI etch, where it provides tapered trenches with top and bottom corner rounding. The 6510 offers depth uniformity and profile micro-loading performance suited for STI applications.[1][2][3]
- polysilicon/silicide gate etch
- shallow trench isolation (STI) etch
- selective anisotropic nitride etch (LOCOS and spacer)
- anisotropic nitride and oxide hard mask open etch
- poly/silicide gate etch
What do the numbers mean?
Power & electrical2
Vacuum & pumping2
- one or two HRē etch modules on a high-vacuum cluster platform[1]
Wafer handling2
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the configuration of the 6510 etch system?
The system can be configured with one or two etch modules on a high-vacuum cluster platform.[1][2]
What is the design rule capability of the 6510?
The 6510 is optimized for device design rules down to 90 nm.[1][2]
What are the typical applications of the 6510 in semiconductor manufacturing?
Typical applications include polysilicon/silicide gate etch, shallow trench isolation (STI) etch, selective anisotropic nitride etch for LOCOS and spacer formation, and anisotropic nitride and oxide hard mask open etch.[1][2]
Not publicly documented
The following facts about the 6510 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6510 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6510 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6510 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6510 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No publicly documented compatible parts, consumables, or accessories for the 6510 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]Tegal - Thin Film Manufacturing Equipment, Etch, Ferroelectrics Etch, Platinum Etch, Oxide Etch, Nitride Etch, Dry Etch, Plasma Etch — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
Compare with similar tools
View all →
The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.
The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.
The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.
