Tokyo Electron
TSP 305 SCCM SE+ Oxide
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Vacuum
ESR80WN, KEG approved[2]
Gas delivery
4 chambers, SCCM Oxide with Y2O3 coating[2]
Optics
SE2000ii[2]
What it is
The TSP 305 SCCM SE+ Oxide processes 300 mm (12-inch) wafers. The system is a multi-chamber platform with four process chambers.[2]
How it works
The process chambers of the TSP 305 SCCM SE+ Oxide feature Y2O3 coating and use an SE2000ii endpoint detection system. The electrostatic chuck is a ceramic ESC with standard Vpp. The system uses a Shimadzu TMP-3403LMC-T4 turbomolecular pump and an MKS pressure monitor. The dry pump is an ESR80WN.[2]
What do the numbers mean?
Vacuum & pumping1
Wafer handling3
- Interface
- 5 Carrier stage (Continuous flow operation) with Semi compliant MENV and FIMS assemblies[2]
Gas & chemistry1
Optics & imaging1
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the TSP 305 SCCM SE+ Oxide are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TSP 305 SCCM SE+ Oxide are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TSP 305 SCCM SE+ Oxide are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TSP 305 SCCM SE+ Oxide are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TSP 305 SCCM SE+ Oxide are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TSP 305 SCCM SE+ Oxide is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]achilles-tech.com — achilles-tech.comachilles-tech.com
- [3]Equipment inventory listing
Last updated Oct 11, 2026.
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