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Tystar

8300

Thermal ProcessTystar 8300 family
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Tystar8300
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How it works

The Tystar 8300 has separate tubes with different allowed process types, including spin-on glass cure, AlGaAs oxidation, annealing, and dry or wet oxidation.[2]

Where it fits in the process flow

The Tystar 8300 is used with cleaned silicon in one tube and with processed silicon or other anneal loads in another tube.[2]

Applications

The Tystar 8300 supports wet oxidation, dry oxidation, annealing, spin-on glass cure, and AlGaAs oxidation.[2]

The Tystar 8300 is used for thermal oxidation of silicon and for oxidation of AlGaAs layers.[2]

  • Thermal processing
  • Spin-on glass cure
  • AlGaAs oxidation
  • Wet oxidation
  • Dry oxidation
  • Wafer cleaning

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • DRY1050 may not be run for more than 3 hours.
  • WET1050 may not be run for more than 24 hours without authorization.
  • No recipe should be run with greater than 1 slpm gas flow without discussing with a supervisor first.

What do the numbers mean?

Control & software12

Available recipe
SOG425.001 - Spin-On Glass Cure[2]
Accurate?
Available recipe
ALGAAS.001 - Oxidation of AlGaAs[2]
Accurate?
Available recipe
ANNEAL.001 - Anneal with variable time and temp.[2]
Accurate?
Available recipe
WET1050.002 - WetOx at 1050°C[2]
Accurate?
Available recipe
DRY1050.002 - DryOx at 1050°C[2]
Accurate?
Available recipe
WETVAR.002 - WetOx, variable temp.[2]
Accurate?
Available recipe
DRYVAR.002 - DryOx, variable temp.[2]
Accurate?
Available recipe
WET1050.003 - WetOx at 1050°C[2]
Accurate?
Available recipe
DRY1050.003 - DryOx at 1050°C[2]
Accurate?
Available recipe
WETVAR.003 - WetOx, variable temp.[2]
Accurate?
Available recipe
DRYVAR.003 - DryOx, variable temp.[2]
Accurate?
Available recipe
ANNEAL.003 - Anneal with variable time and temperature[2]
Accurate?

Configuration & options7

Equipment type
Tube furnace[1]
Accurate?
Tube 1 use
Various applications[2]
Accurate?
Tube 2 use
Cleaned silicon only[2]
Accurate?
Tube 3 use
Processed silicon or other anneals[2]
Accurate?
Tube 1 maximum temperature
800°C max[2]
Accurate?
Tube 2 maximum temperature
1100°C, for ≤24hr[2]
Accurate?
Tube 3 maximum temperature
1100°C, for ≤24hr[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Tube 1——Various applications; supports SOG425.001, ALGAAS.001, and ANNEAL.001.wiki.nanotech.ucsb.edu[2]
Tube 2——For cleaned silicon only; supports WET1050.002, DRY1050.002, WETVAR.002, and DRYVAR.002.wiki.nanotech.ucsb.edu[2]
Tube 3——For processed silicon or other anneals; supports WET1050.003, DRY1050.003, WETVAR.003, DRYVAR.003, and ANNEAL.003.wiki.nanotech.ucsb.edu[2]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of thermal processes can this machine perform?General reference — not yet source-verified

Systems of this class are capable of performing thermal oxidation, diffusion, low-pressure chemical vapor deposition (LPCVD), and thermal annealing. The specific process depends on gas chemistry, temperature profile, and pressure regime.

What is the typical temperature range of such machines?General reference — not yet source-verified

Thermal process furnaces of this type generally operate across a broad range of high temperatures, from moderate annealing steps to high-temperature oxidations and diffusions. The exact range depends on the process requirements.

What are common maintenance considerations for these systems?General reference — not yet source-verified

Routine maintenance includes cleaning of quartzware and chamber components, calibration of temperature sensors and gas flow controllers, and checking seals and exhaust systems. Periodic replacement of heating elements and thermal insulation may be required to maintain performance.

Not publicly documented

The following facts about the 8300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8300 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 8300 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 8300 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 8300 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 8300 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  2. [2]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  3. [3]Tool List - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
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Last updated Oct 3, 2026.