Ulvac
CV 200
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Ulvac CV 200 is a physical vapor deposition (PVD) sputter system. The CV 200 processes 6-inch wafers.[1]
What it is
The Ulvac CV 200 is a physical vapor deposition (PVD) sputtering system used for thin-film deposition in semiconductor manufacturing.[1][2]
How it works
General reference — not yet source-verifiedPVD sputtering systems deposit thin films by ejecting material from a solid target through ion bombardment in a vacuum chamber.
A plasma is generated in a low-pressure gas environment, typically argon, and positive ions are accelerated toward a negatively biased target.
Where it fits in the process flow
General reference — not yet source-verifiedThe Ulvac CV 200 is used in the deposition phase of semiconductor fabrication, typically for metal layers such as aluminum, copper, or titanium.
Prior to deposition, wafers undergo cleaning and sometimes a pre-sputter etch to remove native oxides.
Applications
General reference — not yet source-verifiedThe CV 200 is applied to forming metal interconnects, barrier layers, contact layers, and seed layers for damascene copper metallization.
The system can also deposit magnetic thin films used in sensors and memory devices.
What do the numbers mean?
Wafer handling1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the CV 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the CV 200 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CV 200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CV 200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CV 200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CV 200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]CV 200 — Ulvac | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 1, 2026.
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