West Bond
2426 B Semi-Automatic
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA semi-automatic wire bonder uses a bonding head that descends to place a wire loop between the die bond pad and the package lead. The bond is formed by a combination of heat, pressure, and ultrasonic vibrations, a process known as thermosonic bonding. The operator manually aligns the bond head over each target location before the machine executes the bond.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Needs video card repaired
- Needs new monitor
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 2426 B Semi-Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 2426 B Semi-Automatic are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2426 B Semi-Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2426 B Semi-Automatic are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2426 B Semi-Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2426 B Semi-Automatic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]West Bond 2426 B Semi-Automatic family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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