West Bond
4500
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedThe West Bond 4500 is a wire bonder used in semiconductor packaging for making electrical connections between a die and its package substrate.
The machine is a semi-automatic wedge bonder, typically employed for aluminum or gold wire bonding in hybrid circuits, discrete devices, and multichip modules.
How it works
General reference — not yet source-verifiedWire bonders of the West Bond 4500 class join wires to bond pads using ultrasonic energy, mechanical force, and sometimes heat.
In a wedge-bonding machine the wire is fed through a bonding tool and pressed against the first bond pad while ultrasonic vibration creates a metallurgical weld.
Where it fits in the process flow
General reference — not yet source-verifiedThe West Bond 4500 is used in the packaging segment of semiconductor fabrication, after wafer dicing and die attach, and before encapsulation or molding.
Wire bonding connects the bond pads on the die to the lead fingers or substrate traces, providing electrical interconnection for the packaged device.
Applications
General reference — not yet source-verifiedWedge bonders of this kind are applied in packaging of integrated circuits, power devices, LED modules, and sensor assemblies.
Aluminum wedge bonding is common for power and high-frequency devices, while gold wire may be used for fine-pitch applications.
What do the numbers mean?
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 4500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 4500 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4500 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4500 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4500 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
Last updated Oct 2, 2026.
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