7372E

The West Bond 7372E is a manual dual-head die bonder in the E-Series of manual die bonders from West Bond. The 7372E uses a gantry construction that allows an unlimited work piece size. The machine provides orthogonal motions rather than pivoted motions, and individual axis brakes.^[1]

The 7372E is a dual-head die bonder: the two heads are used alternately to pick up chips, then rotate, place, and bond them. Both pick-up and bonding can be performed by different methods, changeable by detachable heads. The machine action to exchange heads places each one in view at the same use position, and the exchange motions are orthogonal rather than pivoted.^[1]

The 7372E embodies a new three-axis micromanipulator that arrays all machine mechanism above the work plane, so there is no limit to the size of a work piece. Each of the X, Y, and Z axes is straight-line and purely orthogonal, and each axis can be braked pneumatically on signal. Dual counterweights balance the pantograph arm and the tool support individually.^[1]

The standard manipulator control arm locates the control point at table elevation. For very large work pieces, an alternate control arm and wrist-rest are available to move the control point above the work plane. The 7372E includes ESD protection.^[1]

The 7372E sits in the die-attach step of the semiconductor packaging process, after wafer dicing and before wire bonding or encapsulation. The manual bonder is used for attaching individual die to substrates, leadframes, or packages in low-volume or development environments, or for specialized assemblies where automated placement is impractical.

Upstream processes include wafer dicing and die pick-up. Downstream processes include wire bonding, encapsulation, and final testing. The 7372E is suitable for hybrid circuits, microwave modules, and other small-to-medium scale production where manual control is required.

The 7372E is used for manual die bonding in hybrid microelectronics, microwave and RF assemblies, semiconductor packaging, and repair or rework stations. The machine can handle a variety of chip sizes and substrate types via interchangeable pick-up and bonding heads.