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YES

B2

YES B2 family
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YESB2
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What it is

The YES B2 is a plasma processing system in the Shuttlelock Ready Series.[1]

How it works

The YES B2 uses a process module with a main cabinet and remote equipment.[1]

Where it fits in the process flow

The YES B2 requires site planning, installation preparation, and utilities connections before operation.[1]

Applications

The YES B2 is used for plasma processing applications that rely on controlled gas handling, electrical power, exhaust, vacuum, and water or heat-transfer support.[1]

  • Reactive Ion Etching (RIE)
  • Plasma Etching (PE)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • Inductively Coupled Plasma (ICP)
  • Electron Cyclotron Resonance (ECR)

What do the numbers mean?

Power & electrical1

RF generator
500 Watt solid-state 13.56 MHz generator; ICP systems also include an additional 1000 Watt limited solid-state 2 MHz RF generator[1]
Accurate?

Vacuum & pumping1

Primary Module vacuum connection
100 mm, 160 mm (ICP), or 250 mm (ECR) diameter at the pump connection flange[1]
Accurate?

Gas & chemistry1

Process gas channels
Up to sixteen process gas channels under mass flow control, up to eight per chamber[1]
Accurate?

Optics & imaging1

Endpoint detection
Emission spectroscopy and laser-based systems[1]
Accurate?

Control & software2

Control computer
80486-based PC[1]
Accurate?
Operating system
MS-DOS with Windows[1]
Accurate?

Configuration & options1

Process types
RIE, PE, PECVD, ICP, and ECR[1]
Accurate?

Vintage & configurations

  1. 1998-01Manual revision date[1]

    The user manual states a revised January 1998 date.

Documented models & variants

DesignationGenerationVintageChangesSource
SLR-720——Reactive Ion Etch system with RF-powered substrate electrode and circulating-liquid temperature control.nanofab.utah.edu[1]
SLR-730——PECVD system with RF-powered top electrode and substrate temperature control by embedded resistance heater; stated temperature range is 80 C to 400 C.nanofab.utah.edu[1]
SLR-734——PECVD/RIE combination system with RF power switchable between top and bottom electrodes; substrate temperature control by embedded resistance heater; stated temperature range is 80 C to 400 C.nanofab.utah.edu[1]
SLR-740——PE/RIE combination system with RF power switchable between top and bottom electrodes and circulating-liquid temperature control.nanofab.utah.edu[1]
SLR-770 ICP——ICP system with top coil supplied 2 MHz RF at 1000 Watts maximum and bottom electrode supplied 13.56 MHz RF at 500 Watts maximum.nanofab.utah.edu[1]
SLR-770 ECR——ECR system with lower electrode RF power and temperature control, plus a tuner, a high density source with an electromagnet, and a microwave power supply.nanofab.utah.edu[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Primary Module vacuum connection100 mm, 160 mm (ICP), or 250 mm (ECR) diameter at the pump connection flange[1]
  • Process gas channelsUp to sixteen process gas channels under mass flow control, up to eight per chamber[1]
  • RF generator500 Watt solid-state 13.56 MHz generator; ICP systems also include an additional 1000 Watt limited solid-state 2 MHz RF generator[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the B2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • The control-system platform and OS era of the B2 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the B2 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the B2 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the B2 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the B2 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
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Last updated Oct 9, 2026.

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