Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Esec 2100 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2100 XPEsec |
|---|---|---|
| OEM | Applied Materials | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2008– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Esec 2100 |
| Cited variants | — | |
| Specifications | ||
| Voltage | — | 240 V[3] |
| Configuration | — | 50/60 Hz[3] |
| Full Load Power | — | 2300 VA[3] |
| Bonding method | — | Epoxy[2] |
| Cycle time | — | 167 ms[2] |
| Bonding accuracy (3σ) | — | Down to 15 µm[2] |
| Placement precision | — | 5 µm (at 4 placements per second)[4] |
| Placement rate | — | 4 chips per second[4] |
| Wafer size | — | 4" to 12" (on 8" or 12" wafer frames)[2] |
| Die size range | — | 0.25 mm to 20 mm[2] |
| Leadframe size (length) | — | 90 mm to 300 mm[2] |
| Leadframe size (width) | — | 9 mm to 84 mm[2] |
| Frequency | — | 50/60 Hz[3] |
| Phase | — | Single phase[3] |
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