Esec
2100 XP
What it is
How it works
General reference — not yet source-verifiedA die bonder picks individual semiconductor dice and places them onto a substrate or package surface with adhesive or solder. A machine of this class performs a pick-and-place sequence for die attach in the packaging flow.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in semiconductor assembly after wafer processing and before later packaging operations. The Esec 2100 XP belongs in the die attach step, where unpackaged die are affixed to a substrate or leadframe.
Applications
What do the numbers mean?
Power & electrical4
- 50/60 Hz[2]
Wafer handling1
Performance2
Dimensions & facilities1
Configuration & options7
- One Phase[2]
Vintage & configurations
- 2008-05Formal launch[1]
Formally launched at the SEMICON Singapore conference in May 2008.
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2100 xP | — | — | Described as Esec’s latest die attach platform; presented as a revolutionary die bonder. | web.archive.org[4] |
| 2100 xP plus | 2nd generation of the most flexible 300 mm high speed platform | — | Capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. | micro-power.com.hk[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2100 XP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the 2100 XP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 XP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 XP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 XP are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2100 XP are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]oerlikon.com — oerlikon.comoerlikon.com
- [2]Inventory photo
- [3]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
- [4]web.archive.org — esec.com (May 4, 2011)web.archive.org
- [5]2100 XP — Esec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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