Waferpedia

Comparison ledger

DCS 1440 Wafer Cleaner Spinversus1000P

Disco DCS 1440 Wafer Cleaner Spin, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyDisco DCSYES 1000P
Specifications
Configuration5 in. table[1]Parallel plate[4]
Max. workpiece sizeΦ8 inch[2]—
Table RPM100 - 3000 min^-1[2]—
Setting time for cleaning/drying0 - 999 sec[2]—
Cleaning nozzle speed1 - 37.5 °/sec[2]—
Cleaning rangeΦ365 mm (up to 210 x 210 mm)[2]—
Cleaning pressure range2.3 - 11.8 MPa[2]—
Equipment dimensions (W×D×H)400 × 600 × 1220 mm[2]—
Dry massApprox. 124 kg[2]—
Voltage200-240 VAC[1]—
Frequency50/60 Hz[1]—
Table size5 in.[1]—
Arm configurationDouble arm[1]—
Wiring3 Wire + ground[1]—
Model—1000P[3]
System type—Plasma cleaning system[3]
Shelf configuration—Four 16 x 16 inch shelves[3]
Total capacity—1024 square inches[3]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[3]
Number of shelves—4[3]
Shelf size—16 x 16 inches[3]
Power—1000 W[4]
Operation modes—Active, RIE, Downstream[3]
Sample size range—From smallest semiconductor chip to large flat panels[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.co.jpdisco.co.jp
  3. [3]web.archive.orgweb.archive.org
  4. [4]semistarcorp.comsemistarcorp.com