Waferpedia

Comparison ledger

0035235-003 MMD HeadversusMP 300

KLA 0035235-003 MMD Head, Onto Innovation MP 300, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MP 300Onto Innovation
OEMKLAOnto Innovation
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA 0035235-003 MMD HeadOnto Innovation MP 300
Cited variants—
  • MP 300 Metal Film Thickness[1]
  • MP 300 Metal Film Thickness Measurement[2]
  • MP 300 XCU Cu Film Thickness Measurement[3]
Specifications
ConfigurationTSTD PCB ASSY, MMD MEAS HEAD[4]MPIIIXCU[5]
Model0035235-003[4]—
MakeKLA[4]—
Part DescriptionTSTD PCB ASSY, MMD MEAS HEAD[4]—
Compatible SystemKLA AIT-XP[4]—
Manufacturer—Onto Innovation[6]
Category—Metrology & Inspection[6]
Function—Metal film thickness measurement[1]
Wafer size—12 inch[2]
Wafer sizes—4, 6, 8, 12 inch[1]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com