Onto Innovation
MP 300
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Onto Innovation MP 300 is a metrology and inspection system used for measuring metal film thickness on wafers. The MP 300 supports wafer sizes of 4, 6, 8, and 12 inches. The MP 300 XCU is a configuration of the MP 300 designed for copper (Cu) film thickness measurement, and it operates on 12-inch wafers. The MP 300 equipment carries an ONTO / Rudolph brand designation, reflecting its association with both Onto Innovation and Rudolph Technologies.[1][2][6][4][5][3]
How it works
General reference — not yet source-verifiedMetal film thickness metrology instruments determine thickness by directing a measurement signal at the film surface and converting the returned signal into a thickness value. Techniques used in this class of equipment include optical reflectance measurement, eddy-current sensing, and X-ray fluorescence. The measurements are typically non-contact and do not alter the film being measured.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor manufacturing, a metal film thickness measurement tool is used after thin-film deposition steps to verify that the deposited layer meets its target thickness. The tool monitors thickness uniformity across the wafer surface and provides feedback for process control of the deposition equipment. Metal film thickness data support yield monitoring and help detect drift in deposition processes.
Applications
What do the numbers mean?
Wafer handling2
Configuration & options4
- MPIIIXCU[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MP 300 Metal Film Thickness | — | — | Configured for metal film thickness measurement. | waferpedia.com[3] |
| MP 300 Metal Film Thickness Measurement | — | — | Configured for metal film thickness measurement. | waferpedia.com[4] |
| MP 300 XCU Cu Film Thickness Measurement | — | — | Configured for Cu film thickness measurement on 12-inch wafers. | waferpedia.com[5] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is a metrology and inspection system used for?General reference — not yet source-verified
It is used to measure patterned or surfacedefined features and to inspect for defects, variation, or other departures from the intended result.
What kind of data does this class of machine provide?General reference — not yet source-verified
It provides measurement and inspection data such as feature geometry, surface condition, uniformity, and defect-related information.
Is this class of equipment part of the process step itself?General reference — not yet source-verified
No. It is generally a monitoring and analysis tool that sits alongside process steps and supports control of those steps.
What kinds of process issues can it help detect?General reference — not yet source-verified
It can help reveal changes in pattern transfer, surface quality, alignment, uniformity, and other signs that a process is drifting from target behavior.
Why is this class important in manufacturing?General reference — not yet source-verified
It helps confirm that intermediate and finished surfaces meet expected criteria and provides feedback that supports yield and process stability.
Not publicly documented
The following facts about the MP 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MP 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MP 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MP 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MP 300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MP 300 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]waferpedia.com — waferpedia.comwaferpedia.com
- [5]waferpedia.com — waferpedia.comwaferpedia.com
- [6]Onto Innovation MP 300 family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 12, 2026.
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