Waferpedia

Comparison ledger

12 LapperversusDSS 200 Post

Lapmaster 12 Lapper, Ontrak DSS 200 Post, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMLapmasterOntrak
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Ontrak DSS 200
Cited variants—
  • Ontrak DSS200 Series 1[1]
  • Ontrak DSS200 Series 2[2]
  • DSS-200 Series 1[1]
  • DSS-200 Series 2[2]
  • DSS-200 CE[3]
  • Entrepix Synergy[3]
  • Entrepix Integra[3]
Specifications
Outside plate diameter12 inches[4]—
Lapping Speed Range0 to 60 rpm[5]—
Wafer Size Compatibility4 inches or smaller[4]—
Input Voltage110 V[4]—
Frequency60 Hz[4]—
Phase1[4]—
Number of Rings3[4]—
Number of Weights3[4]—
Includes Slurry SystemYes[4]—
Includes TimerYes[4]—
Configuration—With Hepa Mini-Environment[6]
Tool type—double-sided PVA scrubber[2]
Wafer size range—100mm to 200mm[1]
Throughput—45-65 wafers per hour[2]
Post-CMP cleaning applications—oxide, polysilicon, nitride, tungsten, aluminum and copper[2]
Type—Double-sided PVA scrubber / post-CMP cleaner[2]
Wafer sizes (listing)—8 inch[6]
Cleanroom environment (listing)—With HEPA mini-environment[6]
Brush type—Roller PVA[3]
Downforce control—Yes[3]
Drying method—Spin + heat lamp[3]
NH4OH dispense—Yes[3]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]axustech.comaxustech.com
  2. [2]axustech.comaxustech.com
  3. [3]entrepix.comentrepix.com
  4. [4]jmind.comjmind.com
  5. [5]etd.ohiolink.eduetd.ohiolink.edu
  6. [6]inventory listing
  7. [7]inventory listing