Waferpedia

Comparison ledger

NSR 2005 i 9 C i-Lineversus1000 Family

Nikon NSR 2005 i 9 C i-Line, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
OEMNikonUltratech
CategoryLithographyLithography
Wafer sizeStandard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNikon NSR 2005Ultratech 1000 Family
Specifications
ConfigurationHDD & Software included[1]—
Wafer sizeStandard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it[1]—
Reticle6", normal thickness[3]—
Wafer8", OF direction 0*, Ring type wafer[3]—
Lens type5iB3[3]—
Magnification1/5[3]1X[6]
Field size21.2 x 25.2mm[3]—
Lamp power1750 KW[3]—
Light sourceMercury lamp[3]—
Reticle Alignmenti-line, CCD imagining[3]—
MakeNikon[1]—
ModelNSR 2005 i 9 C[1]—
Reticle Size6 inch[1]—
Numerical Aperture (NA)0.57 (selectable <0.57 >0.57)[5]—
Exposure Lighti-line[5]—
Sigma0.56 – 0.80[5]—
Alignment LightHeNe Laser, Halogen Lamp[5]—
Alignment MethodCCD imaging + image processing[5]—
Alignment ModeLSA (HeNe laser) or FIA (halogen lamp)[5]—
XY Stage Drive MethodBall screw drive & two-axis interferometer[5]—
XY Stage Stroke X−115 mm to +150 mm[5]—
XY Stage Stroke Y−160 mm to +115 mm[5]—
Auto Focus MethodHalogen lamp + AF line sensor[5]—
Wafer LevelingTwo-axis ball screw drive[5]—
Chamber Set Temperature23 °C[5]—
Camera TypeCCD[5]—
Power Supply208 V, 3 Phase[4]—
CE Mark CertifiedYes[4]—
Handler TypePrealign II[4]—
Power208 V, 3 Phase[4]—
Manuals IncludedPartial[4]—
# of Cassette / FOUP LoadersCassette Stage[4]—
Robot TypeOEM[4]—
End Effecter TypeOEM[4]—
Handler OptionsSiC Substrate[4]—
System SW (OS) VersionNikon Nest[4]—
Supporting EquipmentSTD OEM Items[4]—
CDAN2[4]—
DIWChilled Water[4]—
PC ModelPresent (original PC type)[5]—
Hard DiskOriginal[5]—
NEST UpgradeVersion: NEST-2[5]—
Wafer Size (6 inch)6 inch[4]—
Wafer Size (8 inch)8 inch[3]—
Numerical Aperture0.57 (range <0.57 >0.57 selectable)[5]—
Sigma Range0.56 – 0.80[5]—
Wafer Alignment MethodsLSA (HeNe laser), FIA (halogen lamp)[5]—
Chamber Temperature Set23 °C[5]—
Camera / VisionCCD Type[5]—
Computer (some units)Standard PDP 11/93[1]—
Wafer Loader (some units)Silicon Carbide Wafer Loader Type 1 Conversion[1]—
Tool type—Photolithography step-and-repeat 1X stepper[6]
Optical design—Wynne Dyson[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]en.wikipedia.orgen.wikipedia.org