Comparison ledger
SUSS MicroTec ACS 300 Gen 2, YES PBV-300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 300 Gen 2SUSS MicroTec | PBV-300YES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 300 | YES PBV-300 |
| Specifications | ||
| Configuration | Includes:[1] | — |
| Wafer size | System tooling for 200/300 mm semi spec wafer sizes[1] | 300mm and 200mm[5] |
| OEM | SUSS MicroTec[2] | — |
| Model | ACS 300 Gen 2[3] | — |
| Equipment type | Coater / Developer[1] | — |
| Automation | fully automatic[2] | Automated[4] |
| Architecture | modular[2] | — |
| Process modes | spin-coating and spray-coating[2] | — |
| Integrated functions | coat, bake, and develop modules[1] | — |
| Process family | — | Polyimide/BCB Vacuum Cure Ovens[4] |
| Associated process applications | — | polyimide, BCB, low-k dielectrics and copper anneal[4] |
| Manufacturer | — | YES[6] |
| Category | — | Thermal / Diffusion[6] |
| Processing range | — | 300mm and 200mm[5] |
| System type | — | Fully automated 300mm and 200mm polyimide/BCB/copper anneal/vacuum bake system[5] |
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