YES
PBV-300
The PBV-300 is a YES polyimide/BCB vacuum cure oven line. The PBV-300 supports 300mm and 200mm processing. The PBV-300 is categorized as Thermal / Diffusion.[1][2]
Wafer size
300mm
Vacuum
Polyimide/BCB Vacuum Cure Ovens[4]
What it is
How it works
Where it fits in the process flow
The PBV-300 is used in wafer fabrication after coating steps to cure polyimide or BCB layers, and after metal deposition for copper anneal.[3][4][2]
The PBV-300 processes wafers after the application of polyimide, BCB, low-k dielectrics, or copper layers, before subsequent metallization or packaging steps.[4][2]
Applications
The PBV-300 is used for polyimide cure, BCB cure, copper anneal, and low-k dielectric processing.[3][4][2]
- polyimide cure
- BCB cure
- copper anneal
- low-k dielectric processing
What do the numbers mean?
Vacuum & pumping2
- System type
- Fully automated 300mm and 200mm polyimide/BCB/copper anneal/vacuum bake system[3]
Wafer handling2
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the PBV-300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PBV-300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PBV-300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PBV-300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PBV-300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PBV-300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]YES PBV-300 family | Waferpedia — waferpedia.comwaferpedia.com
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]web.archive.org — web.archive.orgweb.archive.org
- [4]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 9, 2026.
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