Veeco
ADS 800 Dicing alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
ADT
7500 Dicing
Dicing & Grinding
Disco
DAD 3350 Automatic Dicing
Dicing & Grinding
The Disco DAD 3350 is an automatic dicing saw.
Disco
DAG 810 Automatic
Dicing & Grinding
The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.
Disco
DFD 6340 Automatic Dicing
Dicing & Grinding
The Disco DFD 6340 is an automatic dicing saw.
Disco
DFD 6341
Dicing & Grinding
The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.
Disco
DFD 6341 Automatic Dicing
Dicing & Grinding
The Disco DFD 6341 Automatic Dicing is an automatic dicing saw, a machine used in semiconductor and precision optics manufacturing to singulate individual devices from a substrate.
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