Waferpedia

Comparison ledger

0041-39086 ESC PartversusICP

Applied Materials 0041-39086 ESC Part, STS ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
ICPSTS
OEMApplied MaterialsSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—STS ICP
Cited variants—
  • STS ASE ICP DRIE – FluorineICP[1]
  • STS Multiplex ICPICP[2]
Specifications
Voltage—400 V[3]
Frequency—50 Hz[3]
Technology—Inductively Coupled Plasma (ICP)[3]
Tool type—Inductively coupled plasma etcher[3]
Electrical configuration—400 V, 50 Hz[3]
Process class—Dry etcher[2]
Wafer size—100 mm wafers[2]
Chemistry—Chlorine and bromine chemistry[2]
0041-39086 ESC Part entryICP entryAsk about these tools →Share experience with this comparison →

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]cores.research.asu.educores.research.asu.edu
  2. [2]epfl.chepfl.ch
  3. [3]inventory listing