Comparison ledger
CEE 200 Bake Plate, Mattson 8800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8800Mattson | |
|---|---|---|
| OEM | CEE | Mattson |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 200mm | 200mm |
| Process node | — | 0.25-micron |
| Introduced | — | 1997 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1997 Award recognition · 1997 Product award |
| Control system | — | — |
| Generation | — | third-generation |
| Family | CEE 200 | Mattson 8800 |
| Specifications | ||
| Wafer size | up to 200mm wafer[1] | 200 mm[3] |
| Software | Internal OS[1] | — |
| Voltage | 208V[1] | — |
| Wafer Size | up to 200 mm[2] | — |
| Maximum Temperature | 300 °C[2] | — |
| Bake Methods | Hard contact, Proximity (lift 25-100 μm using N2)[2] | — |
| Exhaust Cover | Yes (removal of fume)[2] | — |
| Smart Pins for Temperature Control | Yes[2] | — |
| Tool type | — | Third-generation RTP tool[3] |
| Process target | — | 0.25-micron process requirements[3] |
| Wafer format | — | Single-wafer[3] |
| Temperature performance | — | Improves temperature uniformity and repeatability[3] |
| Throughput | — | Significantly boosts throughput[3] |
| Ceramic Shield option | — | Backside emissivity independence and better wafer-to-wafer repeatability[3] |
| Nitrogen curtain | — | Minimum pre-purge time and high-throughput configuration[3] |
| High process purge gas flow | — | Fast chamber purging for high-throughput configuration[3] |
| ez-DTC | — | High-throughput configuration and improved control[3] |
| High temperature end effector | — | High-throughput configuration[3] |
| Double O-ring seal system | — | Prevents product loss[3] |
| Swivel cassettes with independent swivels | — | Higher throughput[3] |
| Standard slip-free ring package | — | High temperature slip-free processing and improved uniformity[3] |
| Certifications | — | CE certified and UL listed[3] |
| Generation | — | third-generation RTP tool[3] |
| Process node | — | 0.25-micron[3] |
| Award | — | Semiconductor International Editor's Choice Best Product Award (1997)[3] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →