Comparison ledger
Disco 321, Disco DAD3220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DAD3220Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DAD3220 |
| Specifications | ||
| OEM | Disco[1] | Disco[4] |
| Model | 321[1] | DAD3220[4] |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | Sample Prep Room[4] |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Code | — | SAW3[4] |
| Max workpiece size | — | φ6 inch / 150×150 mm (user-specified specification)[5] |
| X-axis cutting range | — | 160 mm[5] |
| Cutting speed | — | 0.1 - 500 mm/s[5] |
| Y-axis cutting range | — | 162 mm[5] |
| Y-axis index step | — | 0.0001 mm[5] |
| Y-axis positioning accuracy | — | 0.005/160 mm (single error), 0.003/5 mm[5] |
| Z-axis max stroke | — | 32.2 mm (with φ2 inch blades)[5] |
| Z-axis moving resolution | — | 0.00005 mm[5] |
| Z-axis repeatability accuracy | — | 0.001 mm[5] |
| θ-axis max rotating angle | — | 320 deg[5] |
| Spindle rated output | — | 1.5 kW[5] |
| Spindle rated torque | — | 0.48 N·m[5] |
| Spindle rotation speed range | — | 3,000 - 40,000 min⁻¹[5] |
| Equipment dimensions (W × D × H) | — | 500 × 900 × 1,670 mm[5] |
| Equipment weight | — | Approx. 550 kg[5] |
| Display | — | LCD touch panel with graphical user interface[5] |
| Standard functions | — | Auto-alignment, auto-focus, auto-kerf check[5] |
| Spindle lock | — | Shaft lock function for easier blade changing[5] |
| Type | — | Automatic dicing saw[5] |
| Workpiece size | — | 6-inch / 150 × 150 mm workpieces[5] |
| Workpiece note | — | Special specification for 6-inch square workpieces[5] |
| Spindle count | — | Single spindle[5] |
| Equipment width | — | 500 mm[5] |
| Equipment dimensions | — | 500 × 900 × 1,670 mm[5] |
| Functions | — | Auto-alignment, auto-focus, and auto-kerf check[5] |
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