Comparison ledger
Lapmaster 12 Benchtop Lapping Polishing, Logitech PM5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | PM5Logitech |
|---|---|---|
| OEM | Lapmaster | Logitech |
| Category | CMP | CMP |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 12 Benchtop Lapping Polishing | Logitech PM5 |
| Specifications | ||
| Make | Lapmaster[1] | — |
| Model | 12[1] | PM5[6] |
| Category | CMP[2] | — |
| Type/Application | Single sided[3] | — |
| Plate diameter | 12 in[3] | — |
| No. of conditioning rings | 3[4] | — |
| Configuration | Ring lapper[4] | — |
| Base | Rigid, lightweight, cast aluminum base[4] | — |
| Standard RPM | 60 RPM[4] | — |
| RPM range with variable speed drive | 0-60[4] | — |
| Drive motor - lapper | 0.5 HP[4] | — |
| Drive motor - polisher | 0.75 HP[4] | — |
| Length | 25 in[4] | — |
| Width | 18 in[4] | — |
| Height | 24 in[4] | — |
| Estimated shipping weight | 240 lbs[4] | — |
| Approximate weight | 135 lbs / 61 kg[5] | — |
| Approximate dimensions | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[5] | — |
| Electrical system | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[5] | — |
| Motor | 1/3 hp / 0.25 kW motor with gear reducer[5] | — |
| Abrasive feed system | Designed for water or oil based lapping slurries[5] | — |
| Automatic cycle timer | Automatic digital cycle timer[5] | — |
| Ring configuration | Ring lapper[4] | — |
| Ring ID | 4.25 inches[4] | — |
| Manufacturer | — | Logitech[6] |
| Application | — | Polishing and lapping[6] |
| Abrasive autofeed cylinder compatibility | — | Abrasive autofeed cylinder for use with a Logitech PM5 or LP50 system[7] |
| Sample wafer size | — | 4 inch (100mm) or smaller[8] |
| Power supply voltage | — | Single phase AC100V[8] |
| Machine type | — | Lapping and polishing system[8] |
| Number of workstations | — | Single[9] |
| Wafer size | — | 100 mm (4 inches) or smaller[8] |
| Polishing plate material | — | Stainless steel[8] |
| Lapping plate material | — | Cast iron[8] |
| Sample holding method | — | Vacuum[8] |
| Variable plate speed | — | Yes[8] |
| Slurry delivery method | — | Peristaltic pump[8] |
| Roller arm assembly | — | Yes[8] |
| Emergency stop | — | Yes[8] |