Comparison ledger
Oxford Instruments 100 ICP Fluorine, Oxford Instruments Plasmalab 100 Plus RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | Plasmalab 100 Plus RIEOxford Instruments |
|---|---|---|
| OEM | Oxford Instruments | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Oxford Instruments Plasmalab 100 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Configuration | — | Load-locked System[2] |
| Tool type | — | Reactive ion etcher[2] |
| Category | — | Etch[3] |
| Wafer sizes | — | 2, 3, 4, 5, 6, 8, 12 inch[2] |
| System configuration | — | Load-locked system[2] |
| Gas module | — | Currently set up for Ar, O2, Cl2, and SiCl4; capable of 6 gases[2] |
| Included items | — | Computer, keyboard, new flat panel monitor, system chiller, turbo pump, load lock pump, operations manual and documentation[2] |
| Condition | — | Fully refurbished and meeting original specifications[2] |
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