Oxford Instruments
Plasmalab 100 Plus RIE
Plate 01Oxford Plasmalab 100 ICP (ID# 3894)
ClassOneEngineeringWatch on YouTubePlate 02Oxford Plasmalab 100 ICP Etcher (ID# 3811)
ClassOneEngineeringWatch on YouTubePlate 03Video 1 Oxford Plasmalab 100 ICP System ID# 3589
TechnolutionsWatch on YouTube
What it is
The Plasmalab 100 Plus RIE system includes a load-locked configuration and a gas module capable of handling up to six process gases. The system is supplied with a turbo pump, a load lock pump, and a system chiller. The system accepts wafers up to 8 inches in diameter. The system includes a computer, keyboard, and a flat panel monitor.[1][2]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe Plasmalab 100 Plus RIE is used in semiconductor manufacturing after lithography to transfer patterns into underlying layers. The equipment is typically employed in front-end-of-line and back-end-of-line processing for etching dielectrics, silicon, and metals. Upstream steps include photoresist patterning and mask deposition; downstream steps include resist stripping and cleaning.
Applications
General reference — not yet source-verifiedTypical applications include patterning of polysilicon gates, contact hole etching in interlayer dielectrics, and via formation in metallization layers. The system is also used for research and development of new etch processes and materials.
What do the numbers mean?
Vacuum & pumping3
Wafer handling1
Gas & chemistry2
- Gas Module currently set up for the following gases (Capable of 6 Gases):[1]
Control & software1
- Computer, Keyboard, New Flat Panel Monitor[1]
Configuration & options12
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationTurbo Pump[1]
- ConfigurationLoad Lock Pump[1]
- ConfigurationGas Module currently set up for the following gases (Capable of 6 Gases):[1]
- Gas moduleCurrently set up for Ar, O2, Cl2, and SiCl4; capable of 6 gases[1]
- Included itemsComputer, keyboard, new flat panel monitor, system chiller, turbo pump, load lock pump, operations manual and documentation[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of pumping system does the Plasmalab 100 Plus RIE use?
The system includes a turbo pump and a load lock pump for vacuum generation.[1]
Not publicly documented
The following facts about the Plasmalab 100 Plus RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 Plus RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 100 Plus RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 100 Plus RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 100 Plus RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 100 Plus RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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