Tool family
ASM Eagle is a PECVD (plasma-enhanced chemical vapor deposition) system described as a 2-chamber unit with SiH4, N2O, and C3F8 gases.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Eagle XP8 | — | — | Plasma-enhanced atomic layer deposition (PEALD) configuration on the XP8 platform | web.archive.org[1] |
The ASM Eagle Express GoCu is a wire bonder.
ASM Eagle XP is an ALD (Atomic Layer Deposition) system with a 12-inch wafer size.
The ASM Eagle XP 5 is a bonder described as a PE-ALD system mainframe with PC and software.
The ASM Eagle XP 5 PE-ALD is a plasma-enhanced atomic layer deposition system.
The ASM Eagle Xtreme is a wire bonder.
ASM Eagle is a PECVD (plasma-enhanced chemical vapor deposition) system described as a 2-chamber unit with SiH4, N2O, and C3F8 gases.
The ASM Eagle Express GoCu is a wire bonder.
ASM Eagle XP is an ALD (Atomic Layer Deposition) system with a 12-inch wafer size.
The ASM Eagle XP 5 is a bonder described as a PE-ALD system mainframe with PC and software.
The ASM Eagle XP 5 PE-ALD is a plasma-enhanced atomic layer deposition system.
The ASM Eagle Xtreme is a wire bonder.