Datacon 8800

Models in this family

1. 

   8800

   Datacon 8800 FC Smart Line RFID is a reel-to-reel RFID chip attach equipment solution for direct and indirect chip attach, built around the 8800 FC Quantum flip chip bonder.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Datacon 8800 FC QUANTUM advanced	—	—	Described as a new flip chip system with CRYSTAL concept, enhanced motion control, full process and yield control, proven 5 µm accuracy, and up to 10,000 UPH.	besi.com[1]
   Datacon 8800 FC QUANTUM advX	—	—	Described as supporting die sizes from 0.3 to 40 mm with 4 µm placement accuracy and up to 10,000 UPH.	besi.com[2]
   Datacon 8800 CHAMEO advanced	—	—	Described as a chip attach system for wafer-level fan-out packaging with face-down and face-up package designs, 300 mm / 340 mm fan-out wafer level packages, and up to 7,000 UPH.	besi.com[3]
   Datacon 8800 FC Smart Line RFID	—	—	Complete reel to reel solution with integrated dispensing system, post-dispense inspection, dual-head bonding system, 25 slot SEMI standard wafer magazines, thermo-controlled heated press, spooler system, and wafer mapping according to SEMI standard with ALPS conversion licence.	web.archive.org[4]

Sources