Waferpedia

Tool family

Disco DGP 8761

DiscoCMP4 entries
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Models in this family

  1. DGP 8761

    The Disco DGP 8761 is a polishing machine used in semiconductor manufacturing.

  2. DGP 8761 + DFM 2800 In-Line

    Disco DGP 8761 + DFM 2800 In-Line Grinder is a fully automatic in-line grinder configured for 200 mm and 300 mm wafers.

  3. DGP 8761 DFM 2800

    The Disco DGP 8761 / DFM 2800 is a semiconductor wafer grinder and polisher that supports 8-inch and 12-inch wafers, equipped with three spindles (Z1 grinder, Z2 grinder, Z3 polisher) and featuring options for dry polishing, mapping, and various process functions.

    Cited variants

    DesignationGenerationVintageChangesSource
    DGP 8761 / DFM 2800—2012–2020Sources state different vintages and different wafer-size/configuration details across listings.Equipment inventory listing[1]
  4. DGP 8761 DFM 2800 Back

    The Disco DGP 8761 DFM 2800 Back is a dicing and grinding machine used for wafer singulation and related backside material removal in semiconductor manufacturing. Machines of this class combine cutting and material-removal functions for preparing wafers or wafer-mounted workpieces for downstream handling.

All entries

  1. DGP 8761Disco

    The Disco DGP 8761 is a polishing machine used in semiconductor manufacturing.

    CategoryCMP
    14 specs
  2. DGP 8761 + DFM 2800 In-LineDisco

    Disco DGP 8761 + DFM 2800 In-Line Grinder is a fully automatic in-line grinder configured for 200 mm and 300 mm wafers.

    CategoryDicing & Grinding
    32 specs
  3. DGP 8761 DFM 2800Disco

    The Disco DGP 8761 / DFM 2800 is a semiconductor wafer grinder and polisher that supports 8-inch and 12-inch wafers, equipped with three spindles (Z1 grinder, Z2 grinder, Z3 polisher) and featuring options for dry polishing, mapping, and various process functions.

    CategoryCMPWaferWafer Notch Visual Monitoring Alignment Option
    62 specs
  4. DGP 8761 DFM 2800 BackDisco

    General referenceThe Disco DGP 8761 DFM 2800 Back is a dicing and grinding machine used for wafer singulation and related backside material removal in semiconductor manufacturing. Machines of this class combine cutting and material-removal functions for preparing wafers or wafer-mounted workpieces for downstream handling.

    CategoryDicing & GrindingWafer2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier
    40 specs

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing