Disco

DGP 8761 DFM 2800

CMP Wafer Notch Visual Monitoring Alignment Option Disco DGP 8761 family

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DGP 8761 DFM 2800 — Inventory photo — Fig. 01DGP 8761 DFM 2800Inventory photo^[1]

Wafer size

Wafer Notch Visual Monitoring Alignment Option

Power

50/60 Hz^[1]

Vacuum

DISCO Dry Vacuum Cleaner^[2]

What it is

The DGP 8761 / DFM 2800 can be configured for wafer sizes such as 8 inch and 12 inch.^[1]^[2]

How it works

The system includes a dry polishing (DP) type 2 capability.^[1]

The DFM 2800 portion provides tape lamination with a UV chamber option, and wafer notch visual monitoring alignment.^[2]

Where it fits in the process flow

The system integrates with a load FOUP department for carrier wafer slot management and includes mapping perception for wafer handling.^[2]

Applications

Options such as a dicing tape pre-cut unit and auto label printer are available for the system.^[1]

What do the numbers mean?

Power & electrical10

50/60 Hz^[1]
Phase: 3 phase^[1]
Full load Amps: 40 A^[1]
Voltage: 200V +/-10%^[1]
DGP 8761 Power Frequency: 50/60 Hz^[1]
DGP 8761 Phase: 3 phase^[1]
DFM 2800 Power Frequency: 50/60 Hz^[1]
DFM 2800 Full Load Amps: 40 A^[1]
DFM 2800 Phase: 3 phase^[1]
DFM 2800 Voltage: 200V +/-10%^[1]

Vacuum & pumping1

Polishing Residence Collector: DISCO Dry Vacuum Cleaner^[2]

Wafer handling11

Mapping: Load FOUP Department (Carrier Wafer Slot and Insert Slash) with Mapping Perception^[2]
Robot Pick Inline Dedicated: (200 mm / 300 mm wafer dedicated)^[6]
FOUP Opener: Unit 300 mm Wafer Dedicated (with 200 mm adapter)^[6]
Wafer Sizes: 8 inch, 12 inch^[1]
Wafer Sizes: 12 inch^[2]
Wafer Notch Visual Monitoring Alignment Option: Included^[2]
Wafer ID ORC Read Option: Included^[2]
Wafer ID Barcode Print Option: Included^[2]
Wafer size: Wafer Notch Visual Monitoring Alignment Option^[2]
Wafer size: Wafer ID ORC Read Option^[2]
Wafer size: Wafer ID Barcode Print Option^[2]

Control & software1

With HDD & Software^[1]

Accurate?

Configuration & options39

12 inch Kits^[1]; 3 Axis Dry Polishing (DP) Type 2^[1]; Z 1 Grinder^[1]; Z 2 Grinder^[1]; Z 3 Polisher^[1]
Full Load current: 72 A^[1]
Machine Main breaker Rating: 90 A^[1]
Ampere Rating of Largest Load: 33 A^[1]
Interrupt Capacity: 35 kA^[1]
Short Circuit Current Rating: 5000 A^[1]; Machine Main Breaker Rating; 50 A^[1]
Ampere Rating of Largest load: 25 A^[1]; Accessories Available:^[1]; Auto Label Printer^[1]; Dicing Tape Pre-Cut Unit^[1]; Swing NCG Specifications^[2]
Cut Function: 2 functions : Batch Cut and Pre Cut 2 functions^[2]; (DBG, SDBG, Auto TTV function included)^[2]; 3 Wire + Ground^[3]
Spinner Table: 200 mm / 300 mm Universal (Orientation Flat)^[6]
Spindle Configuration: 3 Axis Dry Polishing (DP) Type 2 - Z1 Grinder - Z2 Grinder - Z3 Polisher^[1]
DGP 8761 Full Load Current: 72 A^[1]
DGP 8761 Main Breaker Rating: 90 A^[1]
DGP 8761 Ampere Rating of Largest Load: 33 A^[1]
DGP 8761 Interrupt Capacity: 35 kA^[1]
DGP 8761 Short Circuit Current Rating: 5000 A^[1]
DFM 2800 Main Breaker Rating: 50 A^[1]
DFM 2800 Ampere Rating of Largest Load: 25 A^[1]
Accessories Available: Auto Label Printer, Dicing Tape Pre-Cut Unit^[1]
Cut Functions: Batch Cut and Pre Cut; DBG, SDBG, Auto TTV function included^[2]
S-DBG Specification: DISCO Positioning Table 300mm Acrylic, T-arm1 300mm Porous Type^[2]
Polishing Wheel Specifications: Applicable GDP Polishing Wheel Specifications (Z3-axis)^[2]
Ionizer Units: 12ea specification (DISCO Pure 9ea + LOCAL 3ea)^[2]
UPS System: 2 units^[2]
DTU1531: 2 units^[2]
DFM2800 BG Tape UV Chamber Option: Included^[2]
Attachment Table, Peeling Table Temperature Option: Included^[2]
Attachment Part, Peeling Part Duct Cleaning Unit: Included^[2]
S-DBG Specification (DISCO: Positioning Table 300mm Acrylic, T-arm1 300mm Porous Type)^[2]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
DGP 8761 / DFM 2800	—	2012–2020	Sources state different vintages and different wafer-size/configuration details across listings.	Equipment inventory listing^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Configuration50/60 Hz^[1]
Phase3 phase^[1]
Full load Amps40 A^[1]
Voltage200V +/-10%^[1]
DGP 8761 Power Frequency50/60 Hz^[1]
DGP 8761 Phase3 phase^[1]
DFM 2800 Power Frequency50/60 Hz^[1]
DFM 2800 Full Load Amps40 A^[1]
DFM 2800 Phase3 phase^[1]
DFM 2800 Voltage200V +/-10%^[1]
Polishing Residence CollectorDISCO Dry Vacuum Cleaner^[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What are the key axes or spindles on the DGP 8761?

The DGP 8761 includes a Z 1 Grinder, Z 2 Grinder, and Z 3 Polisher in a three-axis dry polishing arrangement.^[1]

Not publicly documented

The following facts about the DGP 8761 DFM 2800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8761 DFM 2800 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DGP 8761 DFM 2800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8761 DFM 2800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8761 DFM 2800 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DGP 8761 DFM 2800 are on record.
Answerable by: an OEM parts catalog or a service engineer