ASM
AD 829 A
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM AD 829 A is a die bonder for semiconductor packaging and bonding. The ASM AD 829 A has a power rating of 120V 50/60 Hz and a vintage year of 2000.[1]
What it is
General reference — not yet source-verifiedDie bonders perform a critical step in the semiconductor packaging flow, where individual dies are affixed to substrates or packages using adhesives, solders, or other bonding materials.
How it works
General reference — not yet source-verifiedA die bonder operates by precisely positioning a semiconductor die onto a substrate or package and applying a bonding medium. The process often involves automated alignment, dispensing of adhesive or solder, and application of heat or pressure to create a secure bond.
The machine typically includes a work-holding stage, a dispensing system for the bonding material, and a mechanism for picking and placing dies with high accuracy. Many die bonders incorporate vision systems for alignment verification.
Where it fits in the process flow
General reference — not yet source-verifiedIn the semiconductor manufacturing sequence, die bonding follows the dicing of wafers into individual dies and precedes encapsulation, assembly, and final testing. The die bonder receives loose dies from a bulk feeder or carrier tape and loads them into a bond fixture.
Upstream steps include wafer fabrication, photolithography, and die singulation. Downstream processes include lead attachment, encapsulation, and package-level testing.
What do the numbers mean?
Power & electrical1
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power Rating120V 50/60 Hz[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the AD 829 A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the AD 829 A are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 829 A are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AD 829 A are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AD 829 A are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AD 829 A are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]ASM AD 829 A family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 8, 2026.
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