Surfscan SP 3 Particle Defect

The KLA Surfscan SP 3 is a bare wafer inspection station that supports 300 mm wafers. The Surfscan SP 3 incorporates deep-ultraviolet (DUV) illumination. The system was announced by KLA-Tencor on July 11, 2011.^[1][2]

The Surfscan SP 3 uses a deep-ultraviolet (DUV) source and DUV-optimized optics. The system includes DUV-specific apertures that enhance defect capture on unpatterned thin films. A new stage and advanced imaging computer together with algorithm improvements enable increased production throughput. The Surfscan SP 3 provides integrated high-resolution full-wafer haze maps through the SURFmonitor feature, with a resolution of approximately 100 megapixels. Defect coordinate accuracy is improved to enhance re-detection and speed of defect review on e-beam review tools.^[1][2]

The Surfscan SP 3 is designed to support the development and manufacturing of substrates for devices at the 28 nm node and below. In IC fabs, the system is used to monitor unpatterned films after deposition and CMP to ensure process tools are not adding defects. The system also inspects the back side of wafers for defects that could deform the wafer shape during photolithography. Surfscan SP 3 tools can be matched among themselves and correlated to existing Surfscan SP2 and SP2XP baselines.^[2]

The Surfscan SP 3 is used for substrate manufacturing to detect crystalline pits, terracing, voids, and other defects that disrupt transistor electrical integrity. The system provides automated capture of slip lines, scratches, surface roughness, grain size, and other process parameters via high-resolution haze maps. The SP 3 also supports defect classification on blanket films and can be used for IC process monitoring.^[2]