Kulicke & Soffa
782-6
The Kulicke & Soffa 782-6 is a dicing saw used for dicing semiconductor wafers into individual chips. The Kulicke & Soffa 782-6 handles wafers up to 6 inches in diameter and up to 800 µm thick. The Kulicke & Soffa 782-6 dices Si, Glass, Quartz, SiC, Sapphire, and LiNbO3 with kerf widths down to 50 µm.[1][2]
How it works
The Kulicke & Soffa 782-6 uses DI water for blade cooling and rinsing. The achievable kerf width is down to fifty micrometers and is dependent on the blade used.[2]
Applications
The Kulicke & Soffa 782-6 can dice silicon, glass, quartz, silicon carbide, sapphire, and lithium niobate.[2]
- Back end and post processing
- Dicing
What do the numbers mean?
Wafer handling3
Dimensions & facilities1
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the 782-6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 782-6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 782-6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 782-6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 782-6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 782-6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Kulicke & Soffa 782-6 Dicing Saw | CapNetEq — capneteq.comcapneteq.com
- [2]nanofab.ece.cmu.edu — nanofab.ece.cmu.edunanofab.ece.cmu.edu
- [3]waferpedia.comwaferpedia.com
- [4]Equipment - Claire & John Bertucci Nanotechnology Laboratory - College of Engineering - Carnegie Mellon University — nanofab.ece.cmu.edunanofab.ece.cmu.edu
Last updated Sep 8, 2026.
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