Kulicke & Soffa

The Kulicke & Soffa AT Premier is a wire bonder used in semiconductor packaging and bonding.

The K&S Maxum Plus is a wire bonder manufactured by K&S.

The Kulicke & Soffa 4124 Ball is a ball wire bonder for semiconductor packaging and bonding applications.

The K&S WB Max Ultra is a wire bonder used in semiconductor packaging and bonding.

The K&S Rapid Automatic Wire Bonder is an automatic wire bonding system that operates on single-phase 50/60 Hz power.

The K&S 982-6 is a wafer dicing saw manufactured by Kulicke & Soffa.

The Kulicke & Soffa 7100 AD is a wafer dicing saw with electrical specifications of 200-240 VAC, 50/60 Hz, 15 Amps, and 3500 VA.

The Kulicke & Soffa 7100 is a wafer dicing saw for semiconductor singulation.

The Kulicke & Soffa 972 Mask is a mask cleaner used in semiconductor wet processing.

The Kulicke & Soffa IConn Plus is a wire bonder.

The Kulicke & Soffa 782-6 is a dicing saw that handles wafers up to 6 inches and up to 800 µm thick, and dices Si, Glass, Quartz, SiC, Sapphire, and LiNbO3 with kerf widths down to 50 µm.

The K&S ConnX LED Wire Bonder is a wire bonding machine from Kulicke & Soffa, with a vintage year of 2012.

The K&S 8028 SG is a wire bonder manufactured by Kulicke & Soffa.

The Kulicke & Soffa 8060 is a wire bonder used in semiconductor packaging and bonding.

The Kulicke & Soffa 7500 Wafer is a wafer dicing saw used for precision cutting.

The Kulicke & Soffa 8028 is a high-speed fine-pitch wire ball bonder used in semiconductor packaging.

The Kulicke & Soffa 775 Dicing is a dicing saw used for cutting semiconductor wafers into individual chips.

The K&S Maxum Ultra is a wire bonder used in semiconductor packaging and bonding applications.

The K&S IConn MEM Plus is a high-performance wire bonder for memory devices, supporting gold and silver alloy wire bonding.

The Kulicke & Soffa 8060 Wedge is an automatic wire bonder for packaging and bonding applications, capable of bonding gold and aluminum wire and supporting 200 mm wafers.

The Kulicke & Soffa Maximum Ultra is a wire bonder for semiconductor packaging and bonding.

The Kulicke & Soffa 4524 is a ball bonder used in semiconductor packaging.

The Kulicke & Soffa Rapid is a wire bonder.

The Kulicke & Soffa IConn is a wire bonder with 50/60 Hz power, 5000 A interrupt capacity, and 1000 A/10 ms over current rating.

The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.

The K&S Max Ultra is a wire bonder model from Kulicke & Soffa.

The Kulicke & Soffa 4142 Ball is a ball wire bonder used in semiconductor packaging and bonding.

The Kulicke & Soffa 984 6 is a dicing saw specified with 50/60 Hz operation, 208 VAC line voltage, 3100 VA power, and 15 A current.

The Kulicke & Soffa 1488 L Turbo is a wire bonder in the Packaging & Bonding category.

The Kulicke & Soffa 982 10 Plus Wafer is a wafer saw used for dicing and grinding semiconductor wafers.

The K&S 982-10 Wafer is a wafer saw introduced in 1999 that handles 8-inch wafers.

The Kulicke & Soffa Maxum is a wire bonder.

The Kulicke & Soffa 1472 is an automatic wedge bonder used for wire bonding in semiconductor packaging.

The Kulicke & Soffa 3600 Plus is a wire bonder in the Packaging & Bonding category.

The Kulicke & Soffa ConnX is a wire bonder in the Packaging & Bonding category.

The Kulicke & Soffa 780 Dicing is a dicing saw in the Dicing & Grinding category.

The Kulicke & Soffa 4124 Gold Ball is a thermosonic gold ball bonder for wire bonding. The Kulicke & Soffa 4124 Gold Ball supports ball bonding and wedge bonding in a semi-automatic cycle.

The K&S Rapid Pro Automatic Wire Bonder is an automatic ball bonder from the GEN-S series designed for high-performance semiconductor packaging with real-time monitoring and diagnostics.

The Kulicke & Soffa 4523 AD is a wire bonder in the Packaging & Bonding category.

The Kulicke & Soffa IConn ProCu Plus LA is a fully automatic wire bonder for packaging assembly and wirebond applications.

The Kulicke & Soffa 1488 Gold is a gold bonder used in semiconductor packaging and bonding.

The Kulicke & Soffa IConn ProCu is a fully automatic wire bonder for wirebond assembly with support for gold or copper wire connection between chip and substrate.

The Kulicke & Soffa IConn LA is a wire bonder in the Packaging & Bonding category.

The K&S IConn Gold is a wire bonder.

K&S Asterion is a bonder with listed electrical ratings of 3 A, 50/60 Hz single-phase, and nominal operating voltages of 200, 220, or 240 VAC.