Kulicke & Soffa
982-10
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedWafer polishers are used in semiconductor fabrication to planarize surfaces. Chemical mechanical polishing tools remove excess material by combining chemical etching with mechanical abrasion.
How it works
General reference — not yet source-verifiedIn a chemical mechanical polishing system, a wafer is held against a rotating platen covered with a polishing pad. A slurry containing abrasive particles and reactive chemicals is supplied to the pad. The combined chemical and mechanical action removes material from the wafer surface in a controlled manner.
Where it fits in the process flow
General reference — not yet source-verifiedChemical mechanical polishing is performed after deposition or etching steps. Planarization reduces surface topography, which improves the focus margin for subsequent photolithography and supports the formation of multilevel interconnect structures.
Applications
General reference — not yet source-verifiedCMP processes are applied to dielectric films such as silicon dioxide, as well as to polysilicon and metal layers including copper and tungsten. Common uses include interlayer dielectric planarization, shallow trench isolation, and damascene metal patterning.
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What is the K&S 982-10?
The K&S 982-10 is a polisher.[1]
Not publicly documented
The following facts about the 982-10 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 982-10 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 982-10 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 982-10 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 982-10 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 982-10 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Sep 29, 2026.
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