Kulicke & Soffa

IConn ProCu Plus LA

Packaging & Bonding Kulicke & Soffa IConn family

Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Kulicke & SoffaIConn ProCu Plus LA

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Performance

2 µm @ 3 sigma^[2]

Gas delivery

Copper wire option with forming gas^[2]

What is it?

Applications

The bonder is designed for advanced node wafers down to 28 nm or below, indicating its suitability for contemporary integrated circuit packaging requirements. The tool is also used for process development, as it includes wire pull and ball shear testing for process development and control.^[2]

Why won't it start?

Documented failure modes, common issues, and field considerations.

for Parts

What do the numbers mean?

Wafer handling1

Advanced node capability: Advanced node wafers down to 28 nm or below^[2]

Gas & chemistry1

Wire options: Copper wire option with forming gas^[2]

Performance1

Accuracy: 2 µm @ 3 sigma^[2]

Control & software1

Process development/control: Wire pull and ball shear available^[2]

Configuration & options8

for Parts^[1]
Type: Fully automatic wire bonder^[2]
Purpose: Make the electric connexion between the chip and the substratum with a gold or a copper wire^[2]
Typical product: Typical ultra-fine pitch ball grid array product^[2]
Minimum pad pitch: 35 µm^[2]
Minimum wire diameter: 0.6 mils^[2]
Bond area: 56 mm x 87 mm^[2]
Alternate wire option: Option de soudure de fil coincé sous capillaire (capillary wedge, wedge-to-wedge) with aluminum or gold wire^[3]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Wire optionsCopper wire option with forming gas^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the placement accuracy of the IConn ProCu Plus LA?

2 µm at 3 sigma.^[2]^[3]

Not publicly documented

The following facts about the IConn ProCu Plus LA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IConn ProCu Plus LA are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IConn ProCu Plus LA are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IConn ProCu Plus LA are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the IConn ProCu Plus LA is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IConn ProCu Plus LA are on record.
Answerable by: an OEM parts catalog or a service engineer