Kulicke & Soffa
Rapid Automatic
The K&S Rapid Automatic Wire Bonder is an automatic wire bonding system. The K&S Rapid Automatic Wire Bonder operates on single-phase 50/60 Hz power.[1][2][3][4][5]
What it is
How it works
General reference — not yet source-verifiedAutomatic wire bonders typically employ thermosonic bonding, which combines ultrasonic energy, heat, and pressure to form a solid-state weld between the wire and the bond pads on the die and the substrate.
The machine positions a wire capillary precisely, feeds wire, forms a ball bond at the first bond point, then moves to the second bond point to form a stitch bond, cutting the wire after each cycle.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is performed after wafer dicing and die attach, and before encapsulation or molding in the semiconductor assembly process.
Applications
General reference — not yet source-verifiedK&S Rapid automatic wire bonders are used to interconnect a wide variety of semiconductor packages, including ball grid arrays, quad flat packs, and discrete devices.
What do the numbers mean?
Power & electrical4
Configuration & options6
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| K&S Rapid Automatic Wire Bonder | — | 2022–2022 | — | Equipment inventory listing[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the typical daily maintenance required for this machine class?General reference — not yet source-verified
Routine maintenance for wire bonders typically involves cleaning the capillary, changing worn bonding tools, replacing wire spools, and checking the ultrasonic transducer and bond head for wear. Calibration checks of the pattern recognition system and bond placement accuracy are also performed periodically to maintain process quality.
Can this machine class handle copper wire bonding?General reference — not yet source-verified
Yes, many modern automatic wire bonders are designed to support copper wire bonding, which requires careful control of bond parameters and an inert atmosphere, such as nitrogen, to prevent oxidation. Operators should verify that their specific machine configuration includes the necessary hardware and process kits.
What is the typical setup time for changing from one package type to another?General reference — not yet source-verified
Setup time varies, but machines in this class are designed for rapid changeover. Operators typically install a new bond program, change the capillary and wire, and load a new workholder or lead frame magazine. Advanced models may store multiple programs and provide automated changeover features to reduce downtime.
How is process quality typically monitored on such machines?General reference — not yet source-verified
Process quality is monitored through in-situ sensors that detect bond deformation, pull testing of sample wires, and electrical testing of bonded units. Many machines also record traceability data for each bond, enabling statistical process control and defect traceability.
Not publicly documented
The following facts about the Rapid Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rapid Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Rapid Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rapid Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rapid Automatic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Rapid Automatic are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]inventory listing
Last updated Oct 11, 2026.
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