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Laurell

H6-8

Spin coater200mmLaurell H6-8 family
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The Laurell H6-8 is a spin coater. The Laurell H6-8 accommodates up to 200mm wafers. The Laurell H6-8 features a maximum rotational speed of 12,000 RPM.[1][2][3]

H6-8 — web.archive.org
Fig. 01H6-8web.archive.org[1]

Wafer size

200mm

Power

95 to 240VAC, 47/63HZ, ~300 Watts[2]

Vacuum

Vacuum chuck[1]

Gas delivery

Solvent, Base or Acid-based processing[1]

What it is

The Laurell H6-8 is a spin coater for applying thin liquid films to substrates by rotation. The H6-8 is a 650-series HL coater system.[1][2]

The H6-8 accommodates wafers up to ø 200 mm and substrates up to 7 in by 7 in. The H6-8 has a maximum rotational speed of 12,000 RPM based on a ø 100 mm silicon wafer.[1][2]

How it works

The H6-8 uses a controller that allows real-time operator interaction during process execution and supports process programming through associated software. The H6-8 also uses a vacuum chuck and fragment adapter as standard items.[1][2]

Where it fits in the process flow

The H6-8 is typically employed in glove boxes for solvent-based, base-based, or acid-based processing. The H6-8 is also used for coating, etching, developing, rinsing-drying, and cleaning.[1][2]

Applications

The H6-8 supports coating, etching, developing, rinsing-drying, and cleaning. The H6-8 is used with solvent-based, base-based, or acid-based processing.[1][2]

The H6-8 can use a standard vacuum chuck and fragment adapter. The H6-8 also offers chucks and adapters, wafer alignment tools, exhaust and drain options, and a Teflon housing option for elevated-temperature chemistry.[1][2]

  • Coating
  • Etching
  • Developing
  • Rinsing-Drying
  • Cleaning
  • Glove box installation

What do the numbers mean?

Power & electrical1

Power
95 to 240VAC, 47/63HZ, ~300 Watts[2]
Accurate?

Vacuum & pumping4

Vacuum
25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[2]
Accurate?
Standard chuck
Vacuum chuck[1]
Accurate?
Vacuum requirement
25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[1]
Accurate?
Nitrogen/CDA purge pressure
60 to 70 PSIG[1]
Accurate?

Wafer handling4

Maximum rotational speed
12,000 RPM (based on a 100mm silicon wafer)[2]
Accurate?
Substrate capacity
Up to 7" × 7" (178mm × 178mm) substrates[2]
Accurate?
Wafer capacity
Up to 200mm wafers[2]
Accurate?
Substrate capacity
7 inch x 7 inch (178mm x 178mm) substrates[1]
Accurate?

Gas & chemistry2

N2 process/seal purge
60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[2]
Accurate?
Typical process use
Solvent, Base or Acid-based processing[1]
Accurate?

Control & software1

Control software
Laurell Touch process control software; Spin 3000 PC software[1]
Accurate?

Configuration & options4

Series
650-series HL coater system[2]
Accurate?
System type
Spin coater[1]
Accurate?
Maximum rotational speed
12,000 RPM[1]
Accurate?
Standard adapter
Fragment adapter[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
H6-8B———web.archive.org[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Power95 to 240VAC, 47/63HZ, ~300 Watts[2]
  • N2 process/seal purge60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[2]
  • Vacuum25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[2]
  • Typical process useSolvent, Base or Acid-based processing[1]
  • Standard chuckVacuum chuck[1]
  • Vacuum requirement25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[1]
  • Nitrogen/CDA purge pressure60 to 70 PSIG[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate sizes does the H6-8 handle?

It accommodates up to 200 mm wafers and 7 inch by 7 inch substrates.[2][1][3]

What is the maximum rotational speed?

The maximum rotational speed is 12,000 RPM, based on a 100 mm silicon wafer.[2][1][3]

What processes are supported?

The supported processes are coating, etching, developing, rinsing-drying, and cleaning.[2][1][3]

Is PC software required to run the H6-8?

No. Spin 3000 can be used with the controller, but it is not required to program or run the equipment.[2][1][3]

Not publicly documented

The following facts about the H6-8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the H6-8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the H6-8 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the H6-8 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the H6-8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the H6-8 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.

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