Oxford Instruments

The Oxford NGP80 RIE is a plasma etch system located in room W1-062.

The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

Oxford Instruments 800 Plus is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

The Oxford PlasmaPro 100 Cobra is an etcher with 8 inch wafer size, an ICP chamber with Cl2 and BCl3 capability, and three RIE chambers.

The Oxford PRS900 is a computer-driven barrel reactor dedicated to dry resist stripping.

Oxford Instruments Plasmalab 80+ is a compact open-loading reactive ion etch system for R&D or small-scale production.

The Oxford Ion Beam Deposition System is a deposition tool using DC hot wire filament ion-guns.

Oxford Instruments FlexAL is an atomic layer deposition system compatible with TiN, TaN, TiO, TaO, and SiN.

Oxford Instruments Plasmalab 80 Plus RIE is a reactive ion etcher with support for wafers up to 8 inches.

The Oxford Instruments ITC 503 S is a temperature controller with stated power requirements of 100/115 V 7.0 A 250 V~ and 200/230 V 10.0 A.

The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.

The Oxford 100 Nitride is a deposition system manufactured by Oxford Instruments for depositing nitride layers.

The Oxford ITC 4 Temperature Controller is a temperature instrument from Oxford Instruments with voltage options of 100/120V at 1.6A and 200/240V at 0.8A.

The Oxford DTC 2 is a temperature controller manufactured by Oxford.

The Oxford 80 Plus RIE is a reactive ion etcher.

The Oxford Instruments PlasmaPro NGP 1000 is a plasma-enhanced chemical vapor deposition (PECVD) system described as capable of running wafers up to 450 mm.

The Oxford Instruments Plasmalab800+ is a PECVD system.

The Oxford IBD is an ion beam deposition system.

The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching, with a maximum substrate size of 150 mm and a current configuration for 100 mm wafers.

The Oxford 26286 is a cryostat manufactured by Oxford Instruments.

The Oxford Instruments Plasmalab ICP 380 ICP-RIE is an inductively coupled plasma reactive ion etch system.

The Oxford Instruments Ionfab 300 Plus is an ion beam etching and deposition system with SIMS endpoint detection, reported with wafer handling options from small samples to 8-inch wafers.

The Oxford 100 is a plasma-enhanced chemical vapor deposition (PECVD) system designed to produce high-quality films with excellent uniformity and control of film properties such as refractive index, stress, and etch rate.

The Oxford Instruments 800 is a plasma-enhanced chemical vapor deposition (PECVD) system.

The Oxford NordlysMax 2 is an EBSD detector capable of high-speed simultaneous EBSD and EDS data acquisition when paired with the AZtecSynergy system.

The Oxford ITC 503 Temperature Controller is a temperature controller that operates at 100/120V (1.6A) or 200/240V (0.8A).

The Oxford Instruments Plasmalab 80 Plus RIE-PECVD is a dual-chamber reactive ion etcher and plasma-enhanced chemical vapor deposition system.

The Oxford Plasmalab 100 Plus is an inductively coupled plasma (ICP) etcher.

Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.

Oxford Instruments PlasmaPro80 is an RIE dry etcher used for hBN, SiGe, graphite, and graphene etching.

The PlasmaLab M80 Plus – Chlorine is an open load reactive ion etch system for etching compound semiconductors and metals.

The Oxford Instruments 80s is an open load reactive ion etching system configured for etching silicon based films using fluorocarbon gases.

The Oxford Plasmalab 100 ICP 180 is an inductively coupled plasma reactive ion etch system for 2 inch wafers.

The Oxford Instruments PC2000 is a process tool software used to control and monitor Oxford Instruments plasma etch and deposition systems.

The Oxford Instruments Plasmalab80 is a tool that combines etch and deposition capabilities, with plasma etching, materials growth, and wafer processing up to 8-inch diameter wafers.

Oxford PlasmaPro100 is an ICP plasma etcher for 100mm wafers used for chlorine and bromine chemistry.

The Oxford Instruments CMI 950 XRF is an X-ray fluorescence spectrometer.

The Oxford Instruments PlasmaPro NGP80 is a modular, benchtop-scale plasma processing platform for precision thin-film deposition and reactive ion etching (RIE).

The PlasmaPro NGP80 RIE is an Oxford Instruments reactive ion etching system used for processes such as SiO2 hard mask etching with CHF3/Ar plasma at 20°C.

Oxford Plasmalab 80 is a cleanroom etching and deposition tool used for PECVD and dry etch processes.

Oxford Instruments PlasmaPro NGP 1000 is a PECVD system described as capable of running up to 450 mm wafers.

The Oxford 80 Plus is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

Oxford Instruments Ionfab 300 Plus IBD / IBE Tool is an ion beam deposition and ion beam etching system for 6-inch to 8-inch wafers.

The Oxford Instruments Plasmalab 100 is a plasma-enhanced chemical vapor deposition (PECVD) system that handles wafers from 2 to 8 inches and is used for depositing silicon dioxide, silicon nitride, and other dielectric films.

Oxford Instruments Plasmalab 80 uP RIE is a reactive ion etcher that was mainly used for O2 plasma processing and includes a vacuum pump.

Oxford Instruments Plasmalab 100 Plus RIE is a reactive ion etcher with a load-locked system and a gas module set up for Ar, O2, Cl2, and SiCl4.

The Oxford Instruments Plasmalab 800 Plus RIE is a reactive ion etching system described with a PC controller, four gas mass flow controllers, and a 460 mm diameter electrode.

The Oxford Instruments Plasmalab 100 ICP 180 RIE is an etch tool with a 6-inch wafer size and a 208V, 50/60Hz power spec.