Waferpedia

SCREEN

SU 3200 Single Wafer

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The SCREEN SU 3200 Single Wafer is a single-wafer cleaner. The SCREEN SU 3200 Single Wafer processes 12-inch wafers. The SCREEN SU 3200 Single Wafer is compatible with processes for 28 nm node and lower.[1][2]

SCREENSU 3200 Single Wafer
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What it is

The SCREEN SU 3200 is a single-wafer cleaning system manufactured by SCREEN Semiconductor Solutions. The SU 3200 is designed for processing wafers of 12 inch (300 mm) diameter.[3][5][1][4]

How it works

The SU 3200 is expandable to up to twelve processing chambers arranged in four three-level towers. The stacked design and accelerated transport system allow a throughput of up to 800 wafers per hour.[1][4]

The chamber interior volume of the SU 3200 is about one-third that of the preceding model, which improves atmosphere replacement and cleanliness. The chemical supply system is located at the rear of the tool, shortening the path from the chemical source to the wafer. An air balance guide ensures uniform downflow from fan filter units. Proprietary air protection nozzle technology provides watermark-free drying, and advanced splash protection minimizes chemical splash inside the chambers.[1][4]

The SU 3200 uses a Kawasaki robot for wafer handling. The tool supports the SECS/GEMS communication protocol and can be fitted with either a dynamic direct injection or a cabinet-type chemical supply system. The software revision is P2485STD00V2485STD00.[4]

Applications

General reference — not yet source-verified

The tool is suitable for both front-end-of-line (FEOL) and back-end-of-line (BEOL) cleaning applications, including pre-diffusion clean, post-etch residue removal, and pre-metal deposition clean.

What do the numbers mean?

Power & electrical1

System power rating
208AC-3 Phase[4]
Accurate?

Wafer handling7

Type
single-wafer cleaner[1]
Accurate?
Wafer size
12 inch[3]
Accurate?
Throughput
up to 800 wafers per hour[1]
Accurate?
Tool type
Single Wafer Cleaner[1]
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Wafer size
12 inch (300 mm)[4]
Accurate?
Maximum throughput
up to 800 wafers per hour[1]
Accurate?
Wafer handler
Kawasaki robot[4]
Accurate?

Gas & chemistry1

Chemical supply system
dynamic direct injection (DDI) or cabinet-type chemical supply system[1]
Accurate?

Optics & imaging1

Process compatibility
compatible with processes for 28 nm node and lower[2]
Accurate?

Control & software1

Software version
P2485STD00V2485STD00[4]
Accurate?

Configuration & options7

Expandable chambers
up to 12 chambers[1]
Accurate?
Make
SCREEN / DNS[3]
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Model
SU 3200[3]
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Maximum chambers
up to 12 chambers[1]
Accurate?
Chamber arrangement
12 chambers in four three-level towers[1]
Accurate?
Process compatibility
SOM, SPM, SC1/SC2, O3W, and DHF[4]
Accurate?
Communication protocol
SECS/GEMS[4]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Chemical supply systemdynamic direct injection (DDI) or cabinet-type chemical supply system[1]
  • System power rating208AC-3 Phase[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

How is contamination controlled in a single-wafer wet processor?General reference — not yet source-verified

The enclosed process chamber and exhaust system contain chemical vapors. The wafer is handled by robot or edge grip to avoid contact with the device side. Recirculation and filtration of chemicals help maintain purity, and the single-wafer nature prevents cross-contamination between different wafers.

Can single-wafer wet processors handle different wafer sizes?General reference — not yet source-verified

Many single-wafer wet processors are designed to accommodate a range of wafer sizes through adjustable chuck or replaceable hardware. The specific wafer size support depends on the tool's configuration, but the class is scalable from small substrates to larger diameters.

Not publicly documented

The following facts about the SU 3200 Single Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SU 3200 Single Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the SU 3200 Single Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the SU 3200 Single Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the SU 3200 Single Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the SU 3200 Single Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]screen.co.jp — screen.co.jpscreen.co.jp
  2. [2]nanoindustry.su — nanoindustry.sunanoindustry.su
  3. [3]Equipment inventory listing
  4. [4]waferpedia.com — waferpedia.comwaferpedia.com
  5. [5]Equipment inventory listing
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Last updated Oct 7, 2026.

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