SUSS MicroTec
ACS300 Gen3
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ACS300 Gen3 is an automated coating and developing system. The ACS300 Gen3 handles wafers up to 300 mm. The ACS300 Gen3 supports priming, spin coating, baking, and aqueous/solvent developing.[1]
What it is
The SUSS MicroTec ACS300 Gen3 is an automated coating and developing system. The system handles wafers up to 300 mm in diameter. The ACS300 Gen3 supports priming, spin coating, baking, and both aqueous and solvent developing.[1]
What do the numbers mean?
Wafer handling1
Gas & chemistry1
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Process capabilitiesPriming, Spin Coating, Baking, Aqueous / Solvent Developing[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the ACS300 Gen3 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ACS300 Gen3 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ACS300 Gen3 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ACS300 Gen3 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ACS300 Gen3 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ACS300 Gen3 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
Last updated Sep 23, 2026.
Compare with similar tools
View all →The SUSS MicroTec AD12 is a manual system for aqueous developing and wafer cleaning, handling wafers up to 300 mm.
The SUSS MicroTec AS8 / 12 is a manual coating and developing system for wafers up to 300 mm, with spray coating as its primary process.
The SUSS MicroTec ELP300 Gen2 is an automated excimer laser processing system for substrates up to 300 mm, used for ablation, laser-assisted debonding, and seed layer removal.